Die Board Cleaner cleaning series are water-based cleaning media for flux removal of printed circuit boards, ceramic substrates, lead frames and power modules. The media can either be sprayed or be used in immersion or ultrasonic cleaning systems.


  • SYS-CLEAN BC1.0 is best suited to prepare surfaces for subsequent wire bonding and coating operations. BC1.0 is specifically additivated in order to protect very delicate surfaces from unwanted chemical reactions.
    SYS-CLEAN BC1.0 is delivered as concentrate.