Fully automatic modular cleaning system

With the CL533 SYSTRONIC is presenting a new generation of multi-chamber cleaning systems!


Various application fields of cleaning technology are covered with this system. The base system CL533M1.0 consists of separate process chambers for cleaning, rinsing and drying. In this version the system can be used for the cleaning of stencils, squeegees, misprints and subassemblies.


The basic construction of the system with three separate chambers can be extended individual with additional single modules for specific applications. For example further modules can be adapted for additional rinsing steps in PCB cleaning. For stencil cleaning with high throughput drying chambers can be added. Or further cleaning chambers for separating the media in the combination cleaning of stencils and misprints.


The products to be cleaned will insert into a transport frame on the loading module and will automatically transported through the given process. After the process finished the goods carrier gets placed at the unloading module, where the cleaned goods can be removed. This provides a seamless process control.


The loading and unloading module in the base version consists of 4 transport-frame positions, whereof 2 are served for loading and 2 for unloading the system. The stencil, squeegee or PCBs get transported in the transport frames through the plant. According to the expansion the loading and unloading positions can be extended.

Characteristics Systronic CL533 M1.0

  • modular construction
  • robust stainless steel construction
  • separate cleaning, rinsing and drying chamber
  • Combined Spray-in-Air, Spray-under-Immersion and ultrasonic cleaning
  • Use of different cleaning media in separate chambers
  • Load and unload expansion possible


All information for the SYSTRONIC CL533 at a glance: