SYSTRONIC CL 830


IMMERSION PROCESS FOR SOLDER FRAMES AND CONDENSATE FLUX TRAPS

The immersion process with air bubble effect:
The optimised cleaning process of SOLDER FRAMES and CONDENSATE FLUX TRAPS for the small up to middle throughput.

In a mobile unit in stainless steel design the cleaning basin and the sotrage tank for the cleaning liquid are situated. The rinsing takes place by hand shower. An external compressed-air pistol allows intensive drying.  

CHARACTERISTICS SYSTRONIC CL830

  • Automatic cleaning process
  • Higher cleaning efficiency because of the permanent recirculation of the cleaning liquid by immersion process and air bubble effect
  • Compact system with low space requirement
  • Optional: rinsing function
  • Low investment costs
  • Easy handling
  • Low maintenance effort
  • Customised version CL831 with individual dimensions

All information for the SYSTRONIC CL830 at a glance: